Dorazil Mikro-Elektronik GmbH, Development, Manufacturing and Services for Hybrid Circuits in thick and thin film, Multichipmodules (MCM's), Chip on Board (COB), Flip Chip, Assembly Service Mikroelektronik, Elektronik, SMD, Bonden, Drucken, SMT, Hybride, Dickschicht, Dünnfilm, Thinfilm, Thickfilm, MCM, COB, Chip on Board, Multichipmudul, Mikrosysteme, Flip Chip, Flipchip, Flip-Chip, Bestückung, Bestückungsservice, Entwicklung, Layout, Design, Substrat, Leiterplatte, Dorazil, Assembly, Assembly Service, Wafer, Bumps, Ball Grid Array, Circuit, kundenspezifische Hybride, customerspecific hybrid circuits, Löthybride, Chip and Wire, Microelectronic, Flachbaugruppen, Dickschichthybride, Dünnfilmhybride, Hybridhersteller, Hybrid-Hersteller, Chipbestücken, Chipmontage, Optohybride, Opto-Hybride, Mikrosystemtechnik Dorazil-Logo
  Dorazil Mikro-Elektronik GmbH German
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Development
Production
Thickfilm
Thinfilm
MCM
COB
Flip-Chip
Assembly service
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COB
COBDME produces
on different substrates like
- conventional PCB with Ni/Au surface with sizes up to 150mm x 200mm
- Flex with Ni/Au surface with sizes up to 100mm x 100mm
COB DME undertakes the following tasks
- Custom tailored solutions according internal design rules for COB
- Design and layout supported by simulation tools
- Procurement of components, dies and substrates
- Prototyping
- Serial production.
COB DME executes
- production of documentation and programs
- automatic SMD assembly
- thermally or electrically conducting adhesives
- automatical die bonding
- automatical Al- or Au- thinwire bonding up to 30µm
- automatical Al- thickwire bonding from 100µm
- functional and strain test under temperature conditions
- reliability test under extreme conditions like cold, heat, humidity, vibration, shock, acceleration.
- burn-in-test
- passivation of components
- hermetical sealing by epoxy, silicon resin or ceramic covers.
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