Dorazil Mikro-Elektronik GmbH, Development, Manufacturing and Services for Hybrid Circuits in thick and thin film, Multichipmodules (MCM's), Chip on Board (COB), Flip Chip, Assembly Service Mikroelektronik, Elektronik, SMD, Bonden, Drucken, SMT, Hybride, Dickschicht, Dünnfilm, Thinfilm, Thickfilm, MCM, COB, Chip on Board, Multichipmudul, Mikrosysteme, Flip Chip, Flipchip, Flip-Chip, Bestückung, Bestückungsservice, Entwicklung, Layout, Design, Substrat, Leiterplatte, Dorazil, Assembly, Assembly Service, Wafer, Bumps, Ball Grid Array, Circuit, kundenspezifische Hybride, customerspecific hybrid circuits, Löthybride, Chip and Wire, Microelectronic, Flachbaugruppen, Dickschichthybride, Dünnfilmhybride, Hybridhersteller, Hybrid-Hersteller, Chipbestücken, Chipmontage, Optohybride, Opto-Hybride, Mikrosystemtechnik Dorazil-Logo
  Dorazil Mikro-Elektronik GmbH German
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About us
Development
Production
Thickfilm
Thinfilm
MCM
COB
Flip-Chip
Assembly service
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MCM
MCMDME is
- conception of technology according to the requirements
- 1:1 conversion from standard IC to die
- conversion from standard IC to ASIC or FPGA
- layout supported by simulation (SPICE) programs
- production of stencils, sieves and films
- procurement of materials, components, dies and substrates
- documentation including back-persecution
- obsolescence management
MCM DME produces
on different Materials and subtrates like:
- conventional PCB`s (finepitch)
- flexible PCB`s (finepitch)
- ceram with conductors and resistors in thick film technology
- LTCC-ceram in thick film technology (see thick film technology)
- Thin film technology with finest conductors and extremely stable resistors (see thin film technology)

Other Materials upon request.
MCMDME places
- passive SMD-components
- housed semiconductors, IC`s, BGA`s, µBGA`s
- unhoused standard-dies, ASIC`s and Flip-Chips
MCMDME places
- production of printed ceram substrates (thick film)
- structuring of thin film substrates
- passive laser adjustment of resistors
- production of prototypes
- series production
- automatical die bonding
- automatical Al- or Au- thinwire bonding
- automatical Al- thickwire bonding
- laser controlled function adjustment
- functional test under temperature conditions
- burn-in-test
- reliability under extreme conditions like vibration or temperature shock
- documentation of materials and production steps
- hermetical sealing of metal or ceramic housings.
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