Dorazil Mikro-Elektronik GmbH, Development, Manufacturing and Services for Hybrid Circuits in thick and thin film, Multichipmodules (MCM's), Chip on Board (COB), Flip Chip, Assembly Service Mikroelektronik, Elektronik, SMD, Bonden, Drucken, SMT, Hybride, Dickschicht, Dünnfilm, Thinfilm, Thickfilm, MCM, COB, Chip on Board, Multichipmudul, Mikrosysteme, Flip Chip, Flipchip, Flip-Chip, Bestückung, Bestückungsservice, Entwicklung, Layout, Design, Substrat, Leiterplatte, Dorazil, Assembly, Assembly Service, Wafer, Bumps, Ball Grid Array, Circuit, kundenspezifische Hybride, customerspecific hybrid circuits, Löthybride, Chip and Wire, Microelectronic, Flachbaugruppen, Dickschichthybride, Dünnfilmhybride, Hybridhersteller, Hybrid-Hersteller, Chipbestücken, Chipmontage, Optohybride, Opto-Hybride, Mikrosystemtechnik Dorazil-Logo
  Dorazil Mikro-Elektronik GmbH German
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Thickfilm
Thinfilm Substrate Material
- Al² O³ size 4x4 inch; material thickness: 0,25mm; 0,38mm; 0,5mm; 0,635mm; 1,00mm
- AIN size 4x4 inch; material thickness: 0,5mm;
- Glass size 4x4 inch; material thickness: 1,0 – 1,5mm
- Special sizes and thicknesses upon request.
ThinfilmCoating
- Resistive Layer : Chrom/Nickel
- Barrier : Titanium, Palladium, Copper
- Conductor Thickness: Au galvanically intensified up to 10µm
- Conductor Width: from 25µm
- Gold layer bondable and solderable
- Front and back coating
- Metallised vias in ceram and polymer
- Multi layer
- Polyimide und Polymere

Other coatings upon request
ThinfilmResistors
Depending upon thickness the Chr/Ni-Layers have a resistance of 10 to 300 Ohm.
The temperature coefficient at Rt is min. 25ppm/°C or better.
Laser adjust tolerance: according to geometry and value up to 0.01%
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